CN102244165A - LED encapsulation process - Google Patents

LED encapsulation process Download PDF

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Publication number

CN102244165A

CN102244165A CN2011102036752A CN201110203675A CN102244165A CN 102244165 A CN102244165 A CN 102244165A CN 2011102036752 A CN2011102036752 A CN 2011102036752A CN 201110203675 A CN201110203675 A CN 201110203675A CN 102244165 A CN102244165 A CN 102244165A

Authority

CN

China

Prior art keywords

led

curing

transparent

substrate

led chip

Prior art date

2011-07-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Application number

CN2011102036752A

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Chinese (zh)

Inventor

黄泰山

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

FUJIAN TAIDE DIGITAL VIDEO TECHNOLOGY Co Ltd

Original Assignee

FUJIAN TAIDE DIGITAL VIDEO TECHNOLOGY Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-07-20

Filing date

2011-07-20

Publication date

2011-11-16

2011-07-20 Application filed by FUJIAN TAIDE DIGITAL VIDEO TECHNOLOGY Co Ltd filed Critical FUJIAN TAIDE DIGITAL VIDEO TECHNOLOGY Co Ltd

2011-07-20 Priority to CN2011102036752A priority Critical patent/CN102244165A/en

2011-11-16 Publication of CN102244165A publication Critical patent/CN102244165A/en

Status Pending legal-status Critical Current

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Abstract

The invention relates to a light emitting diode (LED) encapsulation process, which comprises the following steps of: (1) performing die bonding, namely placing an LED chip in the middle of a substrate coated with a die bonding adhesive; (2) curing a bonded die, namely baking the LED chip which is subjected to the die bonding, and drying the die bonding adhesive, so that the LED chip is fixed in the middle of a bowl cup of the substrate; (3) welding wires, namely connecting a positive electrode and a negative electrode of the LED chip with a positive electrode support and a negative electrode support electrically by using gold wires; (4) performing dam enclosing, namely fixing the periphery of the LED chip by using a dam enclosing adhesive; (5) coating and curing a transparent adhesive, namely coating a layer of transparent adhesive at the periphery of the LED chip which is subjected to wire welding, and baking the LED chip coated with the transparent adhesive, so that the transparent adhesive is cured; (6) coating and curing fluorescent powder, namely coating a layer of fluorescent powder on the cured transparent adhesive, baking the LED chip coated with the fluorescent powder, so that the fluorescent powder is cured, and repeating the two steps (5) and (6) until light colors emitted by an LED lamp meet the requirement of color temperature; and (7) encapsulating, namely encapsulating a layer of transparent silica gel on the required LED substrate.

Description

The LED packaging technology Technical field The present invention relates to the LED packaging technology, particularly the improvement of the process of LED fluorescent material coating. Background technology LED (Light Emitting Diode, light-emitting diode) is a kind of solid-state semiconductor device that electric energy can be converted into visible light, and it can directly be converted into luminous energy to electric energy.LED is being widely used as a kind of new lighting source material.And the LED encapsulation technology has played a very crucial effect to the light extraction efficiency of light-emitting diode.Now be broadly divided into following several to illumination with the technology that high-power LED encapsulation improves light extraction efficiency on the market: one, directly utilize the luminous efficiency of wafer itself higher, but the luminous efficiency of wafer own is limited and cost is high again; Two, adopt coating bulky grain fluorescent material substrate, once put glue and be shaped, oversized particles fluorescent material does not precipitate easily and causes hot spot to differ, and causes color temperature difference more serious. Summary of the invention Therefore, the present invention is directed to the deficiency of existing LED packaging technology, a kind of improved LED packaging technology is proposed, in the characteristic that does not change luminescent wafer, improvement by the fluorescent material coating process, and realize the great power LED that a kind of color temperature difference is little, optical loss is very little, and LED lamp hot spot and the photochromic uniformity sent. The present invention includes following steps: (1) solid brilliant: that the LED wafer is positioned in the middle of the substrate that scribbles crystal-bonding adhesive; (2) solid brilliant curing: the LED wafer that will consolidate behind the crystalline substance toasts, and the oven dry crystal-bonding adhesive is fixed in the middle of the bowl cup of substrate the LED wafer; (3) bonding wire: electrically connect with the positive and negative electrode support respectively with the both positive and negative polarity of gold thread with the LED wafer; (4) box dam: around the LED wafer, fix with box dam glue; (5) transparent adhesive tape coating and curing: be coated with layer of transparent glue around the LED wafer behind bonding wire, the LED wafer that has been coated with transparent adhesive tape is toasted, make its curing; (6) fluorescent material coating and curing: on the transparent adhesive tape after the curing, be coated with layer of fluorescent powder, the LED wafer that has been coated with fluorescent material is toasted, make its curing; And, repeat (5), (6) two steps, the photochromic colour temperature of sending up to the LED lamp that meets the requirements of; (7) encapsulated moulding: meeting the requirements of encapsulation layer of transparent silica gel on the LED substrate. Further, to select for use be ceramic substrate or aluminium base to described substrate. What further, the substratum transparent in the described fluorescent coating was selected for use is the transparent silicon glue-line of high index of refraction. The present invention adopts as above technical scheme, improvement by the fluorescent material coating process, make fluorescent material applying structure layer for alternately covering phosphor powder layer and substratum transparent, the granule fluorescent material of ultra-thin phosphor powder layer is difficult for precipitation, can not cause hot spot to differ, and is inverted the serious phenomenon of color temperature difference, simultaneously, phosphor powder layer is very thin, and the light that fluorescent material is subjected to send behind LED blue-light excited can diffuse reflection not take place between fluorescent material, has reduced the loss of light.Substratum transparent is the silica gel of high index of refraction, has promptly improved light extraction efficiency and has effectively reduced light decay again.Therefore, multilayer phosphor powder layer and substratum transparent alternatively layered structure can be avoided color temperature difference and optical loss again when guaranteeing fluorescent absorption luminescent conversion efficient, improved light extraction efficiency greatly, and greatly improved hot spot and photochromic uniformity that the LED lamp sends. Description of drawings Fig. 1 is a packaging technology flow chart of the present invention; Fig. 2 is a LED encapsulating structure schematic diagram of the present invention. Embodiment Now the present invention is further described with embodiment in conjunction with the accompanying drawings. Consult shown in Figure 1ly, the present invention includes following steps: (1) solid brilliant: that the LED wafer is positioned in the middle of the substrate that scribbles crystal-bonding adhesive; (2) solid brilliant curing: the LED wafer that will consolidate behind the crystalline substance toasts, and the oven dry crystal-bonding adhesive is fixed in the middle of the bowl cup of substrate the LED wafer; (3) bonding wire: electrically connect with the positive and negative electrode support respectively with the both positive and negative polarity of gold thread with the LED wafer; (4) box dam: around the LED wafer, fix with box dam glue; (5) transparent adhesive tape coating and curing: be coated with layer of transparent glue around the LED wafer behind bonding wire, the LED wafer that has been coated with transparent adhesive tape is toasted, make its curing; (6) fluorescent material coating and curing: on the transparent adhesive tape after the curing, be coated with layer of fluorescent powder, the LED wafer that has been coated with fluorescent material is toasted, make its curing; And, repeat (5), (6) two steps, the photochromic colour temperature of sending up to the LED lamp that meets the requirements of; (7) encapsulated moulding: meeting the requirements of encapsulation layer of transparent silica gel on the LED substrate. Consult shown in Figure 2; it is the LED encapsulating structure after the packaging technology encapsulation of the present invention; comprise: a substrate 11; substrate 11 intermediate solidification one LED wafer 16; the left side of substrate 11; right two ends just respectively are being provided with; the negative pole support; support comprises the insulating barrier 12 and the conductive layer 13 of bottom; LED wafer 16 just; negative pole just is soldered to by gold thread 15 respectively; on the negative pole support; ring is established a corral dam glue 14 on the support; cover fluorescent coating 18 on the LED wafer 16 in the box dam glue 14; outermost layer on the box dam glue 14 encapsulates a transparent silicon glue-line 17 with protection LED lamp pearl, and wherein, fluorescent coating 18 is plural layer phosphor powder layer 181 and substratum transparent 182 alternately laminated formations.It is ceramic substrate or aluminium base that described substrate 11 is selected for use.Described LED wafer 16 specifically is to solidify in the middle of the bowl cup of substrate 11.What the substratum transparent 182 in the described fluorescent coating 18 was selected for use is the transparent silicon glue-line of high index of refraction. Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; in the spirit and scope of the present invention that do not break away from appended claims and limited; can make various variations to the present invention in the form and details, be protection scope of the present invention.

Claims (3)

1.LED packaging technology is characterized in that, comprises the steps: (1) solid brilliant: that the LED wafer is positioned in the middle of the substrate that scribbles crystal-bonding adhesive; (2) solid brilliant curing: the LED wafer that will consolidate behind the crystalline substance toasts, and the oven dry crystal-bonding adhesive is fixed in the middle of the bowl cup of substrate the LED wafer; (3) bonding wire: electrically connect with the positive and negative electrode support respectively with the both positive and negative polarity of gold thread with the LED wafer; (4) box dam: around the LED wafer, fix with box dam glue; (5) transparent adhesive tape coating and curing: be coated with layer of transparent glue around the LED wafer behind bonding wire, the LED wafer that has been coated with transparent adhesive tape is toasted, make its curing; (6) fluorescent material coating and curing: on the transparent adhesive tape after the curing, be coated with layer of fluorescent powder, the LED wafer that has been coated with fluorescent material is toasted, make its curing; And, repeat (5), (6) two steps, the photochromic colour temperature of sending up to the LED lamp that meets the requirements of; (7) encapsulated moulding: meeting the requirements of encapsulation layer of transparent silica gel on the LED substrate. 2. LED packaging technology according to claim 1 is characterized in that: described substrate is selected ceramic substrate or aluminium base for use. 3. LED packaging technology according to claim 1 is characterized in that: described substratum transparent is selected the transparent silicon glue-line of high index of refraction for use. CN2011102036752A 2011-07-20 2011-07-20 LED encapsulation process Pending CN102244165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title CN2011102036752A CN102244165A (en) 2011-07-20 2011-07-20 LED encapsulation process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title CN2011102036752A CN102244165A (en) 2011-07-20 2011-07-20 LED encapsulation process

Publications (1)

Publication Number Publication Date CN102244165A true CN102244165A (en) 2011-11-16

Family

ID=44962113

Family Applications (1)

Application Number Title Priority Date Filing Date CN2011102036752A Pending CN102244165A (en) 2011-07-20 2011-07-20 LED encapsulation process

Country Status (1)

Country Link CN (1) CN102244165A (en)

Cited By (18)

* Cited by examiner, † Cited by third party Publication number Priority date Publication date Assignee Title CN102394266A (en) * 2011-11-30 2012-03-28 陕西科技大学 Curable adhesive type light emitting diode (LED) dispensing structure CN102496674A (en) * 2011-12-23 2012-06-13 惠州市华阳多媒体电子有限公司 Novel light-emitting diode (LED) packaging structure and packaging method capable of forming white light CN102522466A (en) * 2011-12-31 2012-06-27 杭州电子科技大学 Method for packaging LED illuminating device CN102738324A (en) * 2012-04-25 2012-10-17 江苏汉莱科技有限公司 LED (light-emitting diode) COB (Chip on Board) packaging technology and applications thereof CN102738372A (en) * 2012-07-11 2012-10-17 佛山市中昊光电科技有限公司 Novel LED (light emitting diode) integrated light source module and preparation method thereof CN102760826A (en) * 2012-06-21 2012-10-31 安徽科发信息科技有限公司 LED (light-emitting diode) daylight lamp light source packaging method CN103219452A (en) * 2013-04-02 2013-07-24 佛山市金帮光电科技有限公司 Packaging method for realizing high light emitting efficiency of LED by three-layer organic silicon material CN103302006A (en) * 2013-06-24 2013-09-18 苏州东山精密制造股份有限公司 LED die bonding method and LED CN103346247A (en) * 2013-06-18 2013-10-09 上海鼎晖科技有限公司 Flexible COB packaging LED and preparation method thereof CN103413885A (en) * 2013-07-31 2013-11-27 广州硅能照明有限公司 Manufacturing method of isolation type COB light source module CN104659027A (en) * 2015-02-09 2015-05-27 上海三思电子工程有限公司 LED light emitting body and manufacturing method thereof CN105465645A (en) * 2016-01-11 2016-04-06 深圳市立洋光电子股份有限公司 Color-changeable COB LED for spotlights and production method thereof CN106159060A (en) * 2015-04-09 2016-11-23 湖南博元照明科技有限公司 A kind of LED packaging technology CN107275459A (en) * 2017-06-16 2017-10-20 深圳市科艺星光电科技有限公司 Potted element and its manufacture method CN107470091A (en) * 2017-09-14 2017-12-15 深圳市鑫龙邦科技有限公司 A kind of LED COB box dam dispensing all-in-ones and its implementation CN108109533A (en) * 2017-12-15 2018-06-01 深圳市晶台股份有限公司 A kind of method for packing for realizing LED display modules CN111009516A (en) * 2019-11-29 2020-04-14 福建天电光电有限公司 Manufacturing method of high-quality LED light source CN112563390A (en) * 2020-12-15 2021-03-26 南通莱士达光电科技有限公司 LED chip packaging process

Citations (3)

* Cited by examiner, † Cited by third party Publication number Priority date Publication date Assignee Title CN101404314A (en) * 2007-05-30 2009-04-08 夏普株式会社 Light emitting device and method for manufacturing the same US20090121252A1 (en) * 2007-11-14 2009-05-14 Hung-Tsung Hsu Method for manufacturing flip-chip light emitting diode package CN101789483A (en) * 2010-02-05 2010-07-28 江苏伯乐达光电科技有限公司 Coating method of light-emitting diode fluorescent powder

• 2011
  • 2011-07-20 CN CN2011102036752A patent/CN102244165A/en active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party Publication number Priority date Publication date Assignee Title CN101404314A (en) * 2007-05-30 2009-04-08 夏普株式会社 Light emitting device and method for manufacturing the same US20090121252A1 (en) * 2007-11-14 2009-05-14 Hung-Tsung Hsu Method for manufacturing flip-chip light emitting diode package CN101789483A (en) * 2010-02-05 2010-07-28 江苏伯乐达光电科技有限公司 Coating method of light-emitting diode fluorescent powder

Cited By (23)

* Cited by examiner, † Cited by third party Publication number Priority date Publication date Assignee Title CN102394266A (en) * 2011-11-30 2012-03-28 陕西科技大学 Curable adhesive type light emitting diode (LED) dispensing structure CN102522466A (en) * 2011-12-31 2012-06-27 杭州电子科技大学 Method for packaging LED illuminating device CN102738324A (en) * 2012-04-25 2012-10-17 江苏汉莱科技有限公司 LED (light-emitting diode) COB (Chip on Board) packaging technology and applications thereof CN102738324B (en) * 2012-04-25 2013-07-10 江苏汉莱科技有限公司 LED (light-emitting diode) COB (Chip on Board) packaging technology and applications thereof CN102760826A (en) * 2012-06-21 2012-10-31 安徽科发信息科技有限公司 LED (light-emitting diode) daylight lamp light source packaging method CN102738372A (en) * 2012-07-11 2012-10-17 佛山市中昊光电科技有限公司 Novel LED (light emitting diode) integrated light source module and preparation method thereof CN103219452B (en) * 2013-04-02 2015-11-11 佛山市金帮光电科技有限公司 Three layers of organosilicon material are utilized to realize the method for packing of LED high light-emitting rate CN103219452A (en) * 2013-04-02 2013-07-24 佛山市金帮光电科技有限公司 Packaging method for realizing high light emitting efficiency of LED by three-layer organic silicon material CN103346247A (en) * 2013-06-18 2013-10-09 上海鼎晖科技有限公司 Flexible COB packaging LED and preparation method thereof CN103302006A (en) * 2013-06-24 2013-09-18 苏州东山精密制造股份有限公司 LED die bonding method and LED CN103413885A (en) * 2013-07-31 2013-11-27 广州硅能照明有限公司 Manufacturing method of isolation type COB light source module CN104659027A (en) * 2015-02-09 2015-05-27 上海三思电子工程有限公司 LED light emitting body and manufacturing method thereof CN106159060A (en) * 2015-04-09 2016-11-23 湖南博元照明科技有限公司 A kind of LED packaging technology CN105465645A (en) * 2016-01-11 2016-04-06 深圳市立洋光电子股份有限公司 Color-changeable COB LED for spotlights and production method thereof CN105465645B (en) * 2016-01-11 2021-01-19 深圳市立洋光电子股份有限公司 Color-variable COB LED for spotlight and production method thereof CN107275459A (en) * 2017-06-16 2017-10-20 深圳市科艺星光电科技有限公司 Potted element and its manufacture method CN107275459B (en) * 2017-06-16 2024-02-02 万澄林置业(深圳)有限公司 Package element and manufacturing method thereof CN107470091A (en) * 2017-09-14 2017-12-15 深圳市鑫龙邦科技有限公司 A kind of LED COB box dam dispensing all-in-ones and its implementation CN107470091B (en) * 2017-09-14 2022-10-04 深圳市鑫龙邦科技有限公司 A kind of LED COB dam dam dispensing integrated machine and its realization method CN108109533A (en) * 2017-12-15 2018-06-01 深圳市晶台股份有限公司 A kind of method for packing for realizing LED display modules CN111009516A (en) * 2019-11-29 2020-04-14 福建天电光电有限公司 Manufacturing method of high-quality LED light source CN112563390A (en) * 2020-12-15 2021-03-26 南通莱士达光电科技有限公司 LED chip packaging process

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Date Code Title Description 2011-11-16 C06 Publication 2011-11-16 PB01 Publication 2012-02-08 C10 Entry into substantive examination 2012-02-08 SE01 Entry into force of request for substantive examination 2014-01-08 C12 Rejection of a patent application after its publication 2014-01-08 RJ01 Rejection of invention patent application after publication

Application publication date: 20111116